Tag
India's Expenditure Finance Committee has cleared a Rs 1.25 lakh crore outlay for India Semiconductor Mission 2.0, up 64 percent from ISM 1.0's Rs 76,000 crore. The proposal now goes to the Cabinet, as two chip plants begin commercial output and a third, CG Semi, is set to open July 4, 2026.
India laid the foundation stone for its first advanced 3D chip packaging plant in Odisha's Info Valley, with Union Minister Ashwini Vaishnaw officiating the ceremony. The facility targets a critical gap in India's domestic semiconductor supply chain, bridging chip fabrication and finished electronics assembly.
Tag
India's Expenditure Finance Committee has cleared a Rs 1.25 lakh crore outlay for India Semiconductor Mission 2.0, up 64 percent from ISM 1.0's Rs 76,000 crore. The proposal now goes to the Cabinet, as two chip plants begin commercial output and a third, CG Semi, is set to open July 4, 2026.
1h ago · 4 min · Policy & Government
India laid the foundation stone for its first advanced 3D chip packaging plant in Odisha's Info Valley, with Union Minister Ashwini Vaishnaw officiating the ceremony. The facility targets a critical gap in India's domestic semiconductor supply chain, bridging chip fabrication and finished electronics assembly.
2mo ago · 1 min · Technology
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