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India's first advanced 3D chip packaging unit has been inaugurated in Bhubaneswar, backed by a Rs 1,943.53 crore investment combining Rs 799 crore in Central support and roughly Rs 399.5 crore from Odisha state. The facility targets a critical gap in India's domestic semiconductor supply chain. The project marks a
India laid the foundation stone for its first advanced 3D chip packaging plant in Odisha's Info Valley, with Union Minister Ashwini Vaishnaw officiating the ceremony. The facility targets a critical gap in India's domestic semiconductor supply chain, bridging chip fabrication and finished electronics assembly.
Tag
India's first advanced 3D chip packaging unit has been inaugurated in Bhubaneswar, backed by a Rs 1,943.53 crore investment combining Rs 799 crore in Central support and roughly Rs 399.5 crore from Odisha state. The facility targets a critical gap in India's domestic semiconductor supply chain. The project marks a
2mo ago · 1 min · Technology
India laid the foundation stone for its first advanced 3D chip packaging plant in Odisha's Info Valley, with Union Minister Ashwini Vaishnaw officiating the ceremony. The facility targets a critical gap in India's domestic semiconductor supply chain, bridging chip fabrication and finished electronics assembly.
2mo ago · 1 min · Technology
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